KBTeC - Consultancy

KBTeC offers consultancy services in the area of handling and storage of Die Products for use in the manufacture of electronic modules.

Bare Die, including Flip-Chip, are used in System in Package (SiP), electronic modules for automotive, aerospace and military, and in commercial, low-cost, Chip-on-Board (COB) products.

The knowledge applied in this area comes mainly from the many years of working in Die Processing and the EC projects Gooddie I, II and III, ENCAST and ENCASIT.

The long association with Tempo Electronics has led to an understanding of the issues in high speed feeding and assembly of components, especially small, lightweight components such as Bare Die

Much of the basics to die handling are contained in the IEC Technical Report IEC/TR 62258 part 3, available from IEC or from EU National Standards bodies such as BSI.

Part 3 of this series of standards includes a basic checklist for assessing whether a company has adequate controls for handling bare die. As well as consultancy services, KBTeC will carry out an independent audit to an augmented set of questions.

For more information on this or other consultancy services, please contact us.